Keynote Speakers

• Hideki MASUDA, Tokyo Metropolitan University, Japan
• Li-Jun WAN, Chinese Academy of Sciences, China

Invited Speakers

• Katsuhiko ARIGA, National Institute for Materials Science, Japan
• Peng CHEN, Nanyang Technological University, Singapore
• Wei CHEN, National University of Singapore, Singapore
• Yong CHEN, Ecole Normale Supérieure, Paris, France
• James DE YOREO, Lawrence Livermore National Laboratory, USA
• David S. GINGER, University of Washington, USA
• Thomas GREBER, University of Zurich, Switzerland
• Jay T. GROVES, University of California at Berkeley, USA
• Chanzhi GU, Institute of Physics, Chinese Academy of Sciences, China
• Harry HEINZELMANN, CSEM Centre Suisse d’Electronique et de Microtechnique SA, Switzerland
• Yoshihiko HIRAI, Osaka Prefecture University, Japan
• Seunghun HONG, Seoul National University, Korea
• Ling HUANG, Corning Incorporated, USA
• Albena IVANISEVIC, Purdue University, USA
• Norbert KOCH, Humboldt-Universitat zu Berlin, Germany
• Yan LI, Peking University, China
• Chang LIU, Northwestern University, USA
• Xiaogang LIU, National University of Singapore, Singapore
• Ryutaro MAEDA, National Institute of Advanced Industrial Science and Technology (AIST), Japan
• Jwa-Min NAM, Seoul National University, South Korea
• Kornelius NIELSCH, University of Hamburg, Germany
• Federico ROSEI, Université du Québec, Canada
• Veronica SAVU, EPFL, Switzerland
• S. M. SHIVAPRASAD, Jawaharlal Nehru Centre for Advanced Scientific Research, India
• Francesco STELLACCI, Massachusetts Institute of Technology (MIT), USA
• Wanxin SUN, Veeco Asia Pte Ltd, Singapore
• YuHuang WANG, University of Maryland, USA
• Kai WU, Peking University, China
• Nianqiang WU, West Virginia University, USA
• Xianning XIE, National University of Singapore, Singapore
• Rongkun ZHENG, The University of Sydney, Australia