HOME
 
RIO LOGIN
Login email:
Password:
 
New User? Create an Account
Forgot Password?
Retrieve Password
SYMPOSIA LIST
View All Symposia
CGCT-5
Industry Sessions
 
PARTICIPATION
Submit Abstract
Important Dates
Fees & Registration
 
CONFERENCE
Program & Highlights
Schedule Finder
Sponsors & Exhibitors
Committees
Hotels
 
EXHIBITION & SPONSORSHIPS
Program
Make a Booking
Sponsors & Exhibitors
 
SINGAPORE OVERVIEW
Conference Venue
Singapore & Beyond
Travel Visa
 
CONTACT & ENQUIRIES
 
DOWNLOADS & NEWS ARCHIVES
 

 
Symposium R
Organic, Flexible, and Printed Electronics
   
 

Chairs

  • Beng ONG, Institute of Materials Research and Engineering, Agency for Science, Technology and Research, Singapore
  • Jie ZHANG, Institute of Materials Research and Engineering, Singapore

Co-Chairs

  • Zhenan BAO, Stanford University, United States
  • Ananth DODABALAPUR, University of Texas at Austin, United States
  • Jin JANG, Kyung Hee University, South Korea

Correspondence

  • Jie ZHANG, Institute of Materials Research and Engineering, Singapore
    Email: zhangj@imre.a-star.edu.sg
    Tel: +65 6874 4339
    Fax: -
    Mailing Address:
    3 Research Link, Singapore 117602

Scope of Symposium

The phenomenal interest in organic, flexible and printed electronics stems from the expectation that these emerging technologies would deliver enormous economic value and environment benefits. However, translation of these electronic concepts from laboratory to marketplace has presented significant challenges for the development of enabling materials, process, circuit/device design and system integration technologies. To help advance this emerging technology, this symposium brings together scientists and engineers in various disciplines in the organic, flexible and printed electronics community to present and discuss the current issues, latest progress and achievements in their respective research endeavors.
The symposium will cover all subject matters related to organic, flexible and printed electronics, ranging from materials, physics, processes, circuits and integration science and technologies.
Contributions to the following symposium topics are particularly welcome:

Materials:
- New semiconductor materials
- Enabling materials processing
- Encapsulation and barrier materials
- Materials scale-up
- Others
Device and Physics:
- Device fabrication and physics
- Interfacial phenomena
- Novel device concepts and architectures
- Others
Processes:
- Advances in deposition and patterning processes
- Large-area and roll-to-roll processing
- Green printing technologies
- Others
Integrated Electronics:
- Displays
- Sensors, sensor networks, imagers, etc.
- Smart labels and RFID devices
- Solar cells and batteries
- Others

Invited Speakers

  • Ana Claudia ARIAS, University of California Berkeley,
  • Guillermo C. BAZAN, University of California at Santa Barbara,
  • Peter HO, National University of Singapore,
  • A. B. HOLMES, Commonwealth Scientific and Industrial Research Organisation, University of Melbourne, Australia
  • Yongtaek HONG, Seoul National University,
  • Gilles HOROWITZ, Centre National De La Recherche Scientifique,
  • Changming LI, Nanyang Technological University,
  • Yun-Qi LIU, Institute of Chemistry, Chinese Academy of Sciences,
  • Iain MCCULLOCH, Imperial College London,
  • Frank MEYER, University Parkway,
  • Vitaly PODZOROV, Rutgers, The State University of New Jersey,
  • Jean RONCALI, University of Angers,
  • Garry RUMBLES, National Renewable Energy Lab, University of Colorado, Boulder, United States
  • Henning SIRRINGHAUS, Cavendish Laboratory,
  • Takao SOMEYA, University of Tokyo,
  • Kiyoshi YASE, National Institute of Advanced Industrial Science and Technology,
  • Furong ZHU, Hong Kong Baptist University,
Organised by
In association with
Supported by
 COPYRIGHT 2010 ALL RIGHTS RESERVED Conference Managed by Meeting Matters International